November 2, 2021 update.
Finally feels like my transistor circuit designs are completed to the point that designing PCBs for modules is the next step towards building modules. A form of density and functional packaging for the PCBs needs to established, based on the module types. The designs otherwise are in a good place to get started constructing the Model III EMS!
Due to a lot of investment, and thinking about the module layouts, and the UX, I'm going to stick with my 3U FracRak mechanical packaging system, and 3.5mm jacks.
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